Electronics Forum | Tue Dec 05 19:15:41 EST 2000 | Michael Parker
Kel- My first impulse is to tell you to go ahead and try it your way. We all need to learn from our mistakes to find the right way. What you are proposing is called a "smoke" test. As long as you can keep the smoke inside the device, in your case th
Electronics Forum | Thu Nov 30 23:12:22 EST 2000 | Cal
Reno- I also agree. Education and Introduction to SMT are issues we deal with on a daily basis. We have Three level of automated assembly equpiment that we use for prototyping, training, production, and R&D. We can set you up in our facility to run y
Electronics Forum | Tue Nov 21 22:15:59 EST 2000 | Vince Whipple
Mohammed, The first suggested place to start with your question would probably be with your flux Mfr. Push them! The quantity of dross is effected by several factors: The higher your solder pot temp., the higher your dross level... but don't go too
Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
Electronics Forum | Tue Oct 31 03:50:20 EST 2000 | JohnW
Honda, Prnting Glueisn't as difficult as it sounds, as long as you have the right stuff and a good set up. It also depend's on what your going to be placing. If your just doing 0603, 0805 and 1208 than you really only need an 8 thou or 10 thou stenc
Electronics Forum | Thu Oct 26 08:59:56 EDT 2000 | Antonio A. Medina
Ok guys, I need help. Here's the deal. We're getting micro solder balls under discreets on the bottomside of the board. Here's my set up... MPM screener w/vacuum plate 6 mil metal screen with 90% circular (rounded) apertures 7 mil (measured) past
Electronics Forum | Tue Oct 24 12:20:35 EDT 2000 | JohnW
Adam, Did some work on this a bit back via some good old Taguchi DOE and like Dave(the guru)F say's your component terminations is a big factor but I also foundthat the amount of flux you put on as well as the preheat's has an effect, generally we f
Electronics Forum | Mon Oct 09 17:49:29 EDT 2000 | sean
Hello John, The biggest stumbling block is going to be taking these responses and applying them to your assembly process much the same as trying to make other manufacturers' defect levels apply to your process. Ultimately, the overall quality of yo
Electronics Forum | Tue Oct 03 20:35:23 EDT 2000 | Dave F
1. Throughput * Dispenser: Slower, may loose 70% of tact on fast chip shooters * Printer: Can be put in front of and use fast chip shooters effectively 2. Rework Rate ???? Deposition control???? * Dispenser - High control over amount paste - Coplan
Electronics Forum | Fri Sep 29 13:51:46 EDT 2000 | C. Ortner
We work in a "low" volume high reliability house building mixed tech double sided multi layer CCA's for long lived space applications. Our present problem is inspection questioning every dimple/anomaly on every leadless part(we put passives only thr
