Electronics Forum | Fri Aug 21 14:38:00 EDT 1998 | Earl Moon
| It's been one hell of a week.... | From personal experience, what are the most common causes for embrittlement of the solder joint? I just need to make sure I've got all my bases covered. | thanks | -Ben Right on. Yago sangria. Chili conceso. That'
Electronics Forum | Wed Aug 26 00:16:08 EDT 1998 | Jeff Sanchez
| | It's been one hell of a week.... | | From personal experience, what are the most common causes for embrittlement of the solder joint? I just need to make sure I've got all my bases covered. | | thanks | | -Ben | Right on. Yago sangria. Chili conc
Electronics Forum | Thu Aug 06 17:25:55 EDT 1998 | Earl Moon
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis
There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======
Electronics Forum | Tue Jun 16 09:15:56 EDT 1998 | Justin Medernach
| We are very concerned about microcracking in SMT P&P process. I want to know something about: | What is microcracking? | When did it occur? What are the causes? | How can avuid this phenomena? Toni, Micro cracks can be caused by a ton of conditions
Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan
I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon
Electronics Forum | Fri May 01 13:27:18 EDT 1998 | Ray N. Lopez Mata
| | I would like to know something about Siemens machines from users of Siplace or old machines. | | Thanks ! | I currently have a Si-Place S15 and wouldn't get another Siemens for anything. Their service is the worst I've ever seen. The machine
Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Wed Apr 08 12:29:08 EDT 1998 | Justin Medernach
| Is it just me, or does anybody else have problems with open connections on small surface mount headers and connectors? I am talking about small 20 to 40 pin devices, 25 to 50 mil pitch. We put these things on the board, the feet look like they ar
Electronics Forum | Wed Mar 25 14:05:18 EST 1998 | Justin Medernach
| We currently use an abrasive fiberglass brush to clean the silver oxide off of our substrates proir to asembly. It's messy and tiring. Is there an alternative method, either chemical or mechanical that is cost effective for small (30 to 50ea 6in
