Electronics Forum | Thu Oct 26 10:48:17 EDT 2023 | bobpan
It depends on the motherboard that you have. Some dont have a battery but have a Dallas BRam chip. Bob
Electronics Forum | Tue Oct 31 19:34:30 EDT 2023 | dilogic
I have considered this solution, but syringe application is very slow and it's hard to control thickness. It's good for partial covering or applying peelable solder mask. We need to coat circular board ca. 10cm in diameter. Takes a while even with sp
Electronics Forum | Mon Nov 06 03:00:03 EST 2023 | roachindignant
The humidity card must reflect the precise level of humidity present in the shipping container. If the reading is less than 10%, then the relative humidity is less than 10%.
Electronics Forum | Wed Mar 14 18:29:04 EST 2001 | mparker
The basic rule of thumb (info current as of 9/2000, from Ceeris and others) is the 10X multiplier for each major process step. Catching a defect and correcting in SMT will cost $0.10 each. (think about $.04 placement cost, stop line time, operator h
Electronics Forum | Mon Feb 18 09:46:42 EST 2019 | cdav1100
We currently run a Yes Tech BX machine using the Yes Vision software on Windows 7. With Windows 7 support running out in January next year, I was curious if anyone had managed to run the Yes Vision software under Windows 10. The obvious answer is to
Electronics Forum | Wed Jul 21 10:38:10 EDT 2021 | bukas
I got Samsung CP45FV NEO with Cognex 1063200006110P single board computer. This machine had about 10 data corruption problems in past two years on both classic ATA and industrial ATA SSDs. I suspect there may be something wrong with Cognex card and t
Electronics Forum | Mon Jan 14 15:41:41 EST 2002 | gdstanton
MyData packages may be exported in ASCII format with a 3 1/2" floppy. Select Utility, Export, Package, DOS-Diskette, Choose Single or ALL packages, Select Package with Data. The resulting file should look something like this: # *** PACKAGES *** P00
Electronics Forum | Thu Jul 13 10:10:48 EDT 2000 | Todd
Donnie In response to your questions; 1. Flux is Multi-core X32-10M 2. Preheaters temperatures can range based on board density. the goal is to get the top side to 100C before wave. 3. Components can't be placed after wave solder, they are surface m
Electronics Forum | Tue Apr 10 10:10:03 EDT 2001 | Rob Fischer
Obviously the less mass in the wave the better. There will be less heat sinking and less push on the solder. Pallet thickness is typically a function of the tallest component on the board. If the board has one component that is tall but small in a
Electronics Forum | Thu Oct 26 18:10:11 EDT 2000 | ptvianc
Philip: Cases 1-3, those criteria may be specified in more recent versions of ANSI/J-STD-001 and/or ANSI/IPC-A-610. Unfortunately, I do not have any new versions of these specs. that may cover these points. As for voids in BGA joints, I have not
