Electronics Forum: chip (Page 99 of 260)

Dealing with TH Barrels on Bds w/Heavy Ground Planes

Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef

A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta

PBF BGA or PB BGA

Electronics Forum | Mon Dec 01 12:39:06 EST 2008 | tsvetan

this is really nice one ;) paper and cotton have lowest potential to generate static electricity see below, and usually is good practice to wear cotton glowe at least to one of your hands to not leave greasy finger spots on the gold finish of the PC

SOT23s and paste + glue

Electronics Forum | Mon Dec 22 20:16:17 EST 2008 | davef

The first question in solving the "ol' SMT component loss after second-side wave operation" problem is: So, what makes you think the components actually came-off in the wave and not during some previous 'handling'? Putting that aside, we'll play thi

SMT placement machines. Where are we going ?

Electronics Forum | Tue Jun 02 02:52:24 EDT 2009 | jasreeves

Probably covering old ground here, but when I read marketing data, brochures etc for new P&P machines, they always state the CPH. You know... 12,000 chips per hour or 18,000 chips per hour and so on and so forth. However, you try and place 0201's at

SAC BGA in Pb Process

Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef

SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s

Yestech AOI question

Electronics Forum | Thu Dec 16 14:50:49 EST 2010 | rway

What Derek means is, you will have to train new templates from time to time, something you have to do with every AOI. Because there is no established method for marking parts, these markings can change. For instance, the text on chip resistors coul

Mirtec programming discussion

Electronics Forum | Tue Jan 11 13:12:58 EST 2011 | methos1979

Has anyone had any luck programming using the side cameras to inspect for defects on the sides of chip components? We recently had an escape of a damaged chip capacitor that was impossible to see from the top camera but was clearly visible with the

Reflow oven recommendation

Electronics Forum | Fri Nov 19 13:07:01 EST 2010 | vmorina

Hello everyone, Talking to my boss today I was able to determine what we're really looking for in terms of reflow soldering. The company is not looking to do a volume run; we're trying to solder chips for prototype boards, which are currently done w

question about reflow- it it ever a long term solution?

Electronics Forum | Tue Jul 03 16:15:08 EDT 2012 | kq702

Hi, when they did the reflow with the south bridge chipset they took a heat gun and went arround the chip in circles. This is what I did with the broken apple motherboard. I covered the board in tinfoil and cut out the squares arround the gpu, cpu an

Cycle Steel on Fuji XP141

Electronics Forum | Wed Jul 24 22:24:07 EDT 2013 | mac5

When we first got our XP1’s the cycle steal was on a schedule. We would have boards running good and then start placing off in the middle of a run. We finally noticed that the cycle steal had run just prior to the parts being misplaced. We have turne


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