Electronics Forum | Tue Jan 13 13:39:30 EST 1998 | Matt Brown
| I am currently producing a Charity Report for The SMART Group on DSRS which the Group will sell and all the money goes to Charity. Does any one know of any good articles they can send me on double sided reflow assembly ? | I feel that there are onl
Electronics Forum | Thu Jun 13 11:24:25 EDT 2002 | davef
Sorry to hear about the Quality Department thing, but we all have our cross to bear, eh? Through an extended period, say 8 hours, understand change of critical controls in the following: * Conveyor speed. * Side to side temperature differences. * Ti
Electronics Forum | Mon Oct 15 13:41:49 EDT 2001 | bschreiber
Hi Dale, I have copies of the articles of which Mike references. If you need copies for support, contact me at: bill@smartsonic.com. Rinsing should be done by ultrasonics also. Spray in atmosphere systems will not penetrate into the same tight ar
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Tue Dec 04 13:23:05 EST 2001 | fmonette
Hi Steve, It sounds like your product will have many moisture-sensitive devices on both sides. You should be aware of the additional controls that are required to insure the reliability of these components in a double-side reflow application. The
Electronics Forum | Wed Oct 30 10:26:42 EST 2002 | Randy V.
I would perform a simple solderability test per ANSI/J-STD-002. You can do this using a compatable no-clean flux like Indium NC771 and a solder pot. If the leads wet well you do not have a solderability problem. I did not notice what plating was on t
Electronics Forum | Fri Nov 08 05:08:28 EST 2002 | zolasteven
Can anyone advise on the following : 1. Insufficient pcboard support during printing We are printing on double sided pc boards (approx. 8 ins by 6 ins). There is a problem of high paste when we are printing the second side. The reason bsing the boa
Electronics Forum | Fri Nov 08 11:37:44 EST 2002 | jonfox
1. Back in the early days of consumer digital cell phones, we ran into the same problem. PCB with 2000 parts in a 5"x2" area, and double sided. We ended up using our standard vacuum tooling for the NIC side and stiff ESD safe foam for the NAC side
Electronics Forum | Mon Jun 30 10:02:37 EDT 2003 | Steve Gregory
Hi Russ! An "R" QFP is what Altera calls their Plastic Quad Flatpacks that have a heatsink in the top...they actually call them Power Quad Flatpacks. I'm familiar with the formula, of how one can figure out if there's enough surface tension for a p
Electronics Forum | Tue Oct 28 17:40:58 EST 2003 | davef
We theorize a secondary [bottom] side BGA can be wave soldered with planning. Issues are: * Keepout between the BGA and one side of the board that is clear of PTH parts requiring wave soldering, so to support the fixture. * Keepout around the BGA. *
