Electronics Forum | Wed Oct 03 09:23:21 EDT 2012 | kkay
Well what we have seen so far is that the voiding occurs on nearly every part, but only underneath the terminations. When we run a board with no parts we do not see any voiding as there are no terminations to trap the out-gassing from the pads. Next
Electronics Forum | Thu Oct 25 14:15:18 EDT 2012 | kkay
Yes it looks like I attached the wrong reflow profile and I'll get the new one in there. Our TAL should be between 60-90 sec over 217. I'm not sure the embrittlement would be an issue as we have seen this issue across at least 3 different board vendo
Electronics Forum | Wed Sep 26 15:16:29 EDT 2012 | hegemon
Pads look WAY oversize for the LED leads. Perhaps the solder won't go to the LED because it is spreading across the pads on the PCB instead. The board pad vs. component lead size equation I see would make me expect some starvation of the joints at t
Electronics Forum | Wed Sep 26 15:04:09 EDT 2012 | kahrpr
The QSA30 is basically a Samsung CP40 with a few changes. For an older machine the programming is pretty good. it can do array boards and has an import feature for XY data. Tts been about 7 years since I ran one. Its a pretty solid machine.
Electronics Forum | Thu Sep 27 05:47:21 EDT 2012 | bobpan
Check the software version before you buy it. If it is not version 6.75 do not buy it. This is the last version released for this machine and fixes many bugs that made running a panelized board a nightmare. 0603 parts and above is where i would stay
Electronics Forum | Tue Oct 09 14:30:32 EDT 2012 | bandjwet
Put on your Chemical Thinking Caps..... We are ablating the mask of a PCB which was over a copper layer. This exposes copper. Outside of an electrical test (no can do) how could we use a fast non-destructive test in order to determine that copper (
Electronics Forum | Mon Oct 15 08:24:24 EDT 2012 | scottp
You could pay the extra to have the microvias plated shut and planarized. If your voids are larger than 25% of the BGA joint area then I would suspect a solderability problem. Either the board plating or a solder paste problem. If they're less tha
Electronics Forum | Sat Oct 20 14:24:16 EDT 2012 | davef
Not sure why you'd want to immerse an assembled board in 60-70*C IPA for an hour, but I doubt there is much published material on the topic * IPA is toxic * IPA is flammable at room temperature and heating IPA to 60-70*C only makes it more so * There
Electronics Forum | Mon Nov 12 15:21:09 EST 2012 | davef
High-temp ball Sn10Pb90 + eutectic solder paste is common place for MLC reflow. Temperatures necessary to alloy the high-temp ball Sn10Pb90 and eutectic solder would be high enough to compromise interposer, board and many components. What are your:
Electronics Forum | Fri Dec 07 13:31:09 EST 2012 | kenkay
We had a similar issue and it was fixed by trimming the connector so there was barely enough lead protrusion through the board to show a discernible lead. We had to get a special plate and small machine to cut the connectors, but we haven’t had a bri
