Electronics Forum | Tue Sep 09 11:53:36 EDT 2008 | davef
We consider "IR-reflow soldering profile" to be the supplier's recommended reflow thermal profile that a component temination 'sees' for proper soldering, regardless of the method used to reach that temperature. When you say, "We have a lot of defec
Electronics Forum | Mon Sep 29 17:31:39 EDT 2008 | davef
Q1.Does anyone know a way to verify the amount of OSP coating on a board? A1. There is no specification. Thickness is difficult to measure. Thickness is product related. There are at least six major suppliers. Years ago, here on SMTnet, J Medernach s
Electronics Forum | Fri Oct 10 11:36:53 EDT 2008 | stevea
Please visit http://www.ascinternational.com to view all the products offered by ASC International. The LaserVision SP3D is the most economical SPI system in the world offered at a base price of only $14,995. The VisionMaster series of products off
Electronics Forum | Sat Nov 08 09:10:16 EST 2008 | davef
SN100 was designed for selective soldering and producing low levels of voiding. But thin barrel plating is a common cause of voids in wave and selective soldered connections, as you say. As a result, you checked the plating thickness and it was accep
Electronics Forum | Thu Apr 08 02:04:53 EDT 2010 | dilogic
Having no real experience with x-ray inspection, this answer helped a lot. What I actually want is to check top 3 layers and it should be pretty straightforward, as the second layer from the top should be almost empty and the third one should be a gr
Electronics Forum | Tue Apr 13 14:49:15 EDT 2010 | davef
90%) from the sample, and the bake time and temperature specified herein are minimums. To improve test accuracy, or to prevent heat damage, other bake parameters may be AABUS. 2 Applicable Documents IPC-QL-653 Certification of Facilities that Inspect
Electronics Forum | Sat Apr 24 10:43:31 EDT 2010 | davef
Hege: Sounds like this customer is a putz. Ask the putz to sign a release, acknowledging responsibility. Here's a couple more links on imm silver: * http://www.pcbdesignschool.com/wp-content/uploads/2009/08/the-study-measurement-and-prevention-of-t
Electronics Forum | Tue Apr 27 16:00:19 EDT 2010 | scottp
In a nutshell, Cp is a measure of your process variation compared to your spec limits and Cpk is measure of both variation and how well your process is centered within your spec limits. Cp = (USL-LSL)/6*sigma where USL=upper spec limit LSL=lo
Electronics Forum | Tue Jun 07 10:38:34 EDT 2011 | davef
Boots: Here's several methods for guessing at the amount of solder on your connection: * First, 'Down & Dirty' ** Assume that the solder is flat, which is reasonable since it's 'flattened' by the component package ** Assume 100% paste transfer from t
Electronics Forum | Tue Sep 13 11:05:38 EDT 2011 | nucleartoast
I worked for Electrovert for 20 years as a machine designer. Our first computer controlled solder machine the Century 2000 used Infra red pyrometers that were very accurate - once you calibrated it against what you wanted to measure. So the aim and s
