Electronics Forum | Thu Apr 12 22:35:42 EDT 2001 | davef
Consider the profile recommended by your solder paste manufacturer to be the starting point to begin tailoring ramp rate, dwell times, and temperature excursions to meet the requirements of your boad design, the capabilities of your components, and t
Electronics Forum | Mon Apr 16 14:33:50 EDT 2001 | dason_c
Consider to use micro via 10 mil or less, it may help to prevent any solder/flux reflow to the other side and affect your next printing operation. Also, solder void need to be under consideration. Dason.
Electronics Forum | Mon Apr 16 21:00:37 EDT 2001 | davef
I stand by comments in the following thread: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=1199&#Message5372&
Electronics Forum | Wed Apr 18 11:21:03 EDT 2001 | davef
An interesting explanation [from a design engineer perspective] of "skin effect" in RF circuits can be found at http://www.ednmag.com/ednmag/reg/2001/04122001/08john.htm
Electronics Forum | Mon Dec 18 10:49:20 EST 2000 | marys
When reading about the design of high performance cicuits I have recently encountered references to bromine free circuit boards. What are bromine free circuit boards? When would one find them most useful and who supplies such boards?
Electronics Forum | Thu Oct 26 13:10:48 EDT 2000 | ptvianc
Yes, one should always be concerned about "field failures" because they represent the point at which the product has exceeded its design lifetime with respect to its service conditions. Hybrid microciruit technolgy (HMC) has been around for a long t
Electronics Forum | Thu Jul 20 14:25:03 EDT 2000 | Bob Willis
Better design for manufacture Better education for engineers in manufacture at college and university Realising that there is just so far you can push FR4 laminate Finding a way of making all the knowledge in our industry available to those future en
Electronics Forum | Thu Jun 22 15:50:53 EDT 2000 | Dave F
Lee: Here is two materials related questions: Taking a long term view, how are preferred materials selected from a design for the environmental perspective? What are the criteria for determining if a material is recyclable? Who does this?
Electronics Forum | Tue Jun 06 13:19:31 EDT 2000 | ZAKIR AHMAD
Our company do electronic packaging for space applications. One of the problems we face during our design is whether or not to stake/bond the surface mount components to the board to survive the vibration qualification environment. If we do staking
Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef
Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.
