Electronics Forum | Wed Jul 05 17:12:28 EDT 2000 | Michael Parker
Ashok- Rather than ink, consider using a paint marker. This is much more permanent (not easily removed with alcohol), is easily applied, comes in a "pen" like magic markers. Many pen tips available and a large choice of colors too. The down side is
Electronics Forum | Wed May 03 13:56:14 EDT 2000 | Mark Charlton
Does anyone know a formula for determining my "Excess Capacity"? I know my machine's up AND down time, the effective placement rate, and my idle time. If my manager asks me what out "excess capacity" is, how do I use my "knowns" and calculate an ac
Electronics Forum | Fri Apr 28 15:55:39 EDT 2000 | J. G.
I am looking for a company that buys and recycles scrap boards. I talked to some company at NEPCON last year that recycles boards but have since lost their name. I am wondering what people do with thier scrap boards and solder sample boards. Due to t
Electronics Forum | Thu Apr 27 04:41:48 EDT 2000 | Scott Davies
Our R&D people are looking at the possibility of "Silver Through Hole" as an alternative to "Plated Through Hole" for our future PCB specification. Do any of you have any experience of this, advantages/disadvantages, etc. I'm told that the main reaso
Electronics Forum | Mon Mar 20 08:50:47 EST 2000 | Dave F
Scott: Pyros don't like to be heated, so soldering should be done as quickly as possible. Other tips are: * Keep pyro leads long. * Apply solder to the ends of leads. * Heatsink the lead, while soldering by holding the lead with a pair of pliers
Electronics Forum | Thu Feb 24 16:35:02 EST 2000 | D Scott
Larry, I have seen this problem on our IP-3 also. You can recover from this without powering down by going into the I/O page and turning off that particular function. The machine should be fine once you exit out of the I/O page. It almost acts like
Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX
Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar
Electronics Forum | Tue Feb 22 04:29:29 EST 2000 | Gwen Z
First I apologize for my poor English writing. we have no heat sink fins and active cooling with power module. when the board is transported,the vibration of board and power module will shotten the solder joint lifetime. if we just solder it withou
Electronics Forum | Wed Jan 17 20:33:19 EST 2001 | davef
The corner balls are supposed to collapse, but at roughly the same time as the other balls collapse. Also, those balls are located in the place that isthe easiest to get hot. Think about cranking-up the bottom heat, waiting, and slowing down the pr
Electronics Forum | Tue Jan 30 21:14:26 EST 2001 | davef
Suggestions are: * Limit pad width to 0.008" [0.2mm] * Use IPC-7525 Stencil Design Guidelines * Avoid Type 4 pastes, if you can * Slow down your print head to 0.63"/sec [16 mm/sec] * Consider the suggestions on printing by rpereira in the past
