Electronics Forum: mount (Page 100 of 224)

Re: Hybrid solder balls

Electronics Forum | Mon May 15 20:10:27 EDT 2000 | Dave F

David: How about starting with MCMs? IPC docs are: * 2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies * DD-135 - Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip

Re: Tombstone

Electronics Forum | Wed May 31 17:37:29 EDT 2000 | Arturo

I�m also having this problem with Panasonic film capacitor. Even when I have the correct pad size according to Panasonic data sheet the tombstoning occur. I am thinking that the problem could be the plating of the film capacitor. The only way I could

soldering books

Electronics Forum | Fri May 05 18:51:59 EDT 2000 | Steve Thomas

Looking for the best choice in books on soldering processes, primarily reflow but wave is going to be with us for a while so..... If you had to buy one today, which would you start with? Here's the list I gleened from the archives: Coombs, CF, "Pr

Re: about solder bridge

Electronics Forum | Thu Apr 06 00:27:42 EDT 2000 | Dean

I would check their data sheet for the particular product. Thats the range I have for Some Kester products I use... Are you seeing any slumping prior to pick-and-place? Is the bridge in the same place every time? How is your pick-and-place mounting

Thermocouples

Electronics Forum | Wed Jan 31 20:13:49 EST 2001 | davef

Omega Engineering 800.826.6342 http://www.omega.com Dais Instruments, 470 Mount Hope Dr Baltimore, MD 21215 800.268.0857 fax 800.433.9971 Thermo Sensors 972-494-1566 Terra Universal Anaheim CA http://www.terrauni.com Saunders Technology [Temprobes]

Substrate Au/Ni thickness

Electronics Forum | Tue Feb 20 07:31:45 EST 2001 | Nick L

0.076 ~ 0.2 um(micron) but our substrate gold thickness is between 0.3~1.2um. Is there any related to the plating process of substrate! And how can they control this thickness?(May be I should ask substrate vendor their controlling limit). If this i

Epoxy crack causing intermittent failure

Electronics Forum | Thu Feb 22 13:11:51 EST 2001 | keithtbe

Silver epoxy is used to joint the LED beam lead and the trace of the flexi circuit. Due to the LED mounted skew upward or downward unconsistently, the strength of the joint weakened and causing the LED lights up intermittently. I would like to ask fo

Wave soldering

Electronics Forum | Mon Mar 12 07:19:33 EST 2001 | Daniel Carlsson

I have a problem with a mixed technology board. The board have two PGAs which are soldered in the wave soldering machine together with two connectors and a lot of glued surface mounted small components on the secondary side. The problem is that some

Paste life span on the printer

Electronics Forum | Wed Mar 14 22:41:03 EST 2001 | CAL

There are also Process monitoring tools that mount directly to your blades and monitor the paste. Impedance Spectroscopy is the process monitoring theory behind the tool. It works by having good sample data logged that the monitoring tool can compare

How to test & measure capacitors/resistors shear force strength

Electronics Forum | Fri Mar 30 18:24:12 EST 2001 | davef

There is no test. Beyond the issues that you mentioned that affect shear, an article published in a recent [1/01] "Journal Of Surface Mount Technology" documents that shear is also dependent on the rate of shear. You may be able to contact the auth


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