Electronics Forum: preheat (Page 100 of 117)

TAL during reflow

Electronics Forum | Fri Feb 10 12:21:44 EST 2006 | Cal Kolokoy

DaveF is correct in saying that TAL is not the best metric to use in reflow soldering. That is why paste manufacturers give such a wide range; typically 30 to 120 seconds. The peak temperature is more important, especially in the mixed Pb and Pb-F

Beginners' steps to run wave soldering process

Electronics Forum | Thu Feb 16 14:06:51 EST 2006 | russ

You are pretty much on your own when selecting fluxes. search archives in forums and see what everyone else is using and doing. Whoever you purchased the wave from should be installing this machine, certifying it, and providing training for your

profile ramp starts in??

Electronics Forum | Mon Feb 20 20:57:35 EST 2006 | Cal Kolokoy

The ramp sets the stage for flux activation, and if ramping in a linear fashion, burning off some of the volatiles, but yet preserving the activators. The ramp is also intended to preheat the SMDs to prevent thermal shock. Most solder paste data sh

PACE TF1500 or 1700 BGA Rework feedback

Electronics Forum | Thu Feb 23 12:43:12 EST 2006 | MikeL

I am not a current user of PACE TF1500 however, I have evaluated it along with other systems before making a decision. Wasn't a good system for us. We could not achieve consistency / repeatable results from board to board. Basically, we found it t

3 x BGA reflow or placing BGA with repair station?

Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie

Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG

Wave Solder - solder bubbles/outgassing??

Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon

Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to

BGA opens

Electronics Forum | Wed Jan 24 11:24:07 EST 2007 | ruggi

I'm probably not telling you anything you don't already know, but a technique that's worked very well in the past for me is to methodically step through every part of the process and observe your boards being built, or take a scrap or simulated one a

Low Melt Solder Chemistry for use in Rework Process

Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo

After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the

Lead manufacturing to lead free transisition

Electronics Forum | Thu Mar 01 21:20:47 EST 2007 | J.R.

Let's talk pin holes and blow holes. I've been here since the transistion of leaded to lead-free process started for our company and we purchased a wave machine just to keep up with our lead-free orders. we put out 500-1000 boards a day both leaded a

soldering robot

Electronics Forum | Wed Mar 28 09:32:27 EDT 2007 | realchunks

Solder iron robots tend to miss solder joints from time to time. The wire feeder systems are the key to these machines. Most use the edge of the board for alignment is another reason they miss. If you have SMD close to the thru-hole, the robot may


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