Electronics Forum | Wed Jun 23 11:47:48 EDT 1999 | Dave F
| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann
Electronics Forum | Wed Jun 23 14:23:14 EDT 1999 | Cunli Jia
Dave, Looks like you just replied to Ryan's original question, but the message itself shows that the two of you have been going back and forth. Did you copy from your email discussion? Just curious whether something is going wrong with the Forum.
Electronics Forum | Wed Jan 14 14:36:29 EST 1998 | Mike Cox
Your questions would require volumes of information to answer completely. This is a readers digest version to help you get started volumes Don't rely on inspection as a process indicator of your quality and defect levels. Unfortunately Inspectio
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Thu Aug 22 01:57:30 EDT 2002 | Bob Willis
Although the following is not true capability machine assesment I feel that monioring the process at screen print, placement, reflow and wave gives results for both design and process guys to asses thire process. The project has been running since Ma
Electronics Forum | Thu Mar 23 14:17:47 EST 2000 | Finepitch Services
Stuart, My suggestion is a DFM meeting (most of the process people dream about a meeting like this, and luckily, I've been to a few) with: - project manager (if there's one) - customer service rep (annual volume, lot size, product life) - smt proce
Electronics Forum | Thu Mar 23 14:17:47 EST 2000 | Finepitch Services
Stuart, My suggestion is a DFM meeting (most of the process people dream about a meeting like this, and luckily, I've been to a few) with: - project manager (if there's one) - customer service rep (annual volume, lot size, product life) - smt proce
Electronics Forum | Thu Jul 12 17:43:50 EDT 2001 | Steve
In order to understand your printing process, you cannot rely soley on 2D inspection. By implementing 3D-true volumetric measurement, a more comprehensive approach to correcting the process variation can be established. True volumetric / 3D inspect
Electronics Forum | Wed Oct 03 17:10:32 EDT 2001 | davef
Your component is probably EPTSSOP [Exposed Pad Thin Shrink Small Outline Package]. We had a thread on EPTSSOP a couple of months ago. [Check the fine SMTnet Archives for background.] You�re correct that voids in the solder on the exposed pad [rea
Electronics Forum | Wed May 05 23:26:29 EDT 1999 | Dean
| OK, my manager read an article on printing glue (aaargghh!)and wants to know why we aren't doing it. We currently use Fuji GLs and GDMs to dispense glue. I've never done it, but have seen it done at NEPCON and other shows. It looks OK, BUT what
