Hi,
I have some BGA devices, a plastic FBGA memory chip (to be replaced) and an exposed-die FBGA processor here which need reworking. I picked up an Aoyue hot air rework station (http://www.aoyue.com/en/ArticleShow.asp?ArticleID=383) along with the preheater (http://www.aoyue.com/en/ArticleShow.asp?ArticleID=331) for some other PLCC and TSOP work and I wonder if it can successfully be used to rework BGA devices as well. BGA nozzles do exist for it.
From what I've been reading, BGA devices require very specific temperature profiles which are very precisely controlled. The Aoyue station, while very inexpensive cannot control temperature with great precision.
I'm wondering if anyone could give some pointers here on whether these tools will be ok for the job.
Thank you, -Rada
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