Hello PR,
PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of adhesive patterns to be successfully deposited using a standard screen printer. New techniques, including ProFlow� DirEKt Imaging, enhance the speed, repeatability and flexibility of PumpPrint� to far outstrip the capabilities of current adhesive dispensers.
Using A Screen Printer To Deposit Adhesives enhances throughput and gives manufacturers the flexibility to re-deploy existing printing resources, instead of purchasing dedicated adhesive dispensing equipment. Since the process is completed in a single stroke, the cycle time is constant and independent of the number of adhesive deposits. This provides greater control over line utilisation and product scheduling.
Stencils are made from an acrylic material that is easily and accurately machined. The stencils can be mounted within a standard mesh mounted frame using polyester mesh as normally applied to metal mounted masks, or a frame tensioning system can be used with PumpPrint. They are available in standard thicknesses from 1.0mm to 3.0mm (up to 8mm for special applications) to suit any assembly, allowing deposit heights from 75�m to1mm.
Stencil Apertures Act Like Individual Nozzles, allowing deposit height to be controlled by the aperture diameter. Stencils are designed to suit a comprehensive range of components from 0603 passives to large QFPs. Bottom-side routing allows the stencil to clear underside-mounted components and through-hole leads that have been cut & clinched. This extra flexibility further enhances the strength of PumpPrinting over dispensing.
Adhesive printing without ProFlow� DirEKt Imaging is accomplished using squeegees with a profile developed specifically for the process. Using ProFlow� DirEKt Imaging to PumpPrint� adhesives makes setting up quicker and easier, allows a faster print speed to be maintained, and isolates the adhesive from ambient conditions. Also the PumpPrint� Process Is Used Successfully With Solder Paste to deposit paste around through-hole component leads for extrusive reflow, enabling wave soldering of PTH and mixed technology assemblies to be eliminated. Similarly solder paste can be printed into the base of packages several milimetres deep.
Faster, more flexible and more cost-efficient than dispensing.
Nozzle changeovers eliminated.
Re-deploy existing printing resources.
Stencils generated using Gerber, HPGL, DXF and ODB++ or DEK can scan direct from a PCB.
Lightweight, solvent resistant stencils.
Thicknesses 1.0mm, 1.5mm, 2.0mm, 3.0mm (up to 8mm for special applications).
Deposit heights from 75�m to 1mm.
Compatible with component sizes from 0603 to large QFPs.
Underside routing clears components , cut and clinched leads, paste and solder mask.
We'll see you at the APEX show!
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