Hi there,
I want help on the following issue.
Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating is 90-10 SnPb and solder paste is Indium NC-SMQ92J
We have had two different problems with this component. 1.- No wetting.- Actually we tried with a lot of things (solder paste, different pad finish -hasl, gold- reflow profile optimization, reflow on nitrogen ambient) and Run with nitrogen ambient has the best results, but is about $40K yearly and Management is looking to avoid using nitrogen. Also, since we're an automotive supplier, get approval is not so easy...
2.- Component placed Skewed (shifted). This issue we cannot control it, is being placed at last in the sequence and with the lowest speeds on all movements, the compontent is not placed accurately all the time. The component tends to place skewed on the pre-rotation direction. is there a way we can calibrate the placement for a IP3? we currently use a glassplate, but I think only X&Y is being calibrated. other thing is all other components are being placed well, we place another 20 mil pitch component (but less pins) with which we do not have the same problem.
Thanks in advance for your help
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