BGA REWORK- IR OR HOT AIR CONVECTION ? IS THE BEST

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Dear ALL, I Wish to know 1.which type of rework station... - Apr 12, 2007 by

Hi aram, Hot air is best. IR takes longer and is affecte... - Apr 12, 2007 by Real Chunks

Consider how the vast majority of PCBs with BGAs are produce... - Apr 20, 2007 by

For small boards simple components (low mass, dark colors, e... - Apr 21, 2007 by

aram

#48985

BGA REWORK- IR OR HOT AIR CONVECTION ? IS THE BEST | 12 April, 2007

Dear ALL,

I Wish to know 1.which type of rework station is best compare to the IR or HOT air convection. 2.Which process plays best reliabilty on soldering after post soldering process. Pls, suggest ur best

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Real Chunks

#48988

BGA REWORK- IR OR HOT AIR CONVECTION ? IS THE BEST | 12 April, 2007

Hi aram,

Hot air is best. IR takes longer and is affected by the color of the part.

Best post solder process that affects solder the most is handling.

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Hegemon

#49212

BGA REWORK- IR OR HOT AIR CONVECTION ? IS THE BEST | 20 April, 2007

Consider how the vast majority of PCBs with BGAs are produced. Forced air convection. Anything that comes closer to duplication of the original soldering profile is what you desire. Did they build it with IR or Convection? The process engineer was paid (hopefully ) good money to figure out the variables in the temperature profile, to consider proper creation of the solder joints and to keep the BGA component safe. My vote is for forced air, though some of the newer machines that use an IR heater for bottom side heat are promising, such as the AirVac DRS 25, our latest machine purchase. Currently we have 2 APE Sniper II's, 2 AirVac DRS24, and 1 AirVac DRS25 (recently installed)

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#49216

BGA REWORK- IR OR HOT AIR CONVECTION ? IS THE BEST | 21 April, 2007

For small boards simple components (low mass, dark colors, etc), IR can be of good help.

Forced hot air works much better and in a reliable way. According to the configuration (ie.high power bottom heaters, etc) you can remove/replace large and heavy components (ie. BGA, even CCGA 52.5 mm x 52.5 mm >150 grams)on a very thik board (> 3,5 mm)( we did it by DRS-24).

On top to this, in case of need you can use also hot N2 (Nitrogen)and get low ppm of O2, for instance when soldering on OSP finisching using NC paste, etc, if required.

Regards...GS

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