We have filed returned (approx. 5%) of the boards that exhibit inner layer short @ a particular connector locations. X-section revealed there exhibit Cu residue, but aside from that, we also suspect there could be organic contaminant, what test should be done to confirm there is organic contaminantn in the INNER layers??
2nd thing, the board house told us the Cu resiude is due to under-etch problem, so what normally cause under-etch? and what check&balance they should so that to ensure no more defect escape?? AOI is not going to help, correct? because we are talking about Cu particles... any inputs are greatly appreciated. Thanks a lot !!!
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