Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
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In my project of flip chip PGA production , I found serious ...
- May 01, 2009
by
kareal
You have a board defect. Any moisture and/or organic contami...
- May 02, 2009
by
davef
Thanks davef.
The defect always occurred during UHAST re...
- May 02, 2009
by
kareal
any other suggestion for it?
...
- May 07, 2009
by
kareal
We don't have a good answer for you, but we do have several ...
- May 07, 2009
by
davef
Hi Davef,
Do you means it is natural for tin diffusion t...
- May 07, 2009
by
kareal
From our notes, the following is a series of snips from: "Co...
- May 07, 2009
by
davef
Hi Davef,
I want to explain that the tin diffusion in my...
- May 08, 2009
by
kareal
Board fabricators use solder as a resist to protect copper t...
- May 08, 2009
by
davef
Davef,
do you have some information about your mention "...
- May 08, 2009
by
kareal
X-section image: tin layer on top of copper trace.
...
- May 08, 2009
by
kareal
For more on using tin as a resist during bare board fabricat...
- May 09, 2009
by
davef
The whitish tin layer and the solder mask appear to be incom...
- May 09, 2009
by
davef
Davef,
It seems the tin resist residue on copper trace i...
- May 09, 2009
by
kareal