Re: Why would I want to use photonic soldering for my rework applications?

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Why would I want to use photonic soldering for my rework ap... - Sep 18, 2000 by aflewelling

Photonic Soldering is useful for several applications in re... - Sep 18, 2000 by Erick Russell

Reworking BGA with hot air systems (ie, AirVac, SRT) is fai... - Sep 18, 2000 by davef

Process control for Photonic soldering is based on the actu... - Sep 20, 2000 by Erick Russell

aflewelling

#6262

Why would I want to use photonic soldering for my rework applications? | 18 September, 2000

Why would I want to use photonic soldering for my rework applications?

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Erick Russell

#6263

Re: Why would I want to use photonic soldering for my rework applications? | 18 September, 2000

Photonic Soldering is useful for several applications in rework where current methods using hot air are inadequate or inefficient. For high-density assemblies, component clearances are limited. In the past, DFM (Design for Manufacturing) specifications to facilitate BGA rework have been as wide as 0.020 inches for �Hot Air� rework systems. Photonic soldering requires no nozzles or tooling to shield adjacent components, so the DFM specification for some assemblies can be reduced or eliminated. For some high volume rework applications, the process times can be reduced dramatically.

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davef

#6264

Re: Why would I want to use photonic soldering for my rework applications? | 18 September, 2000

Reworking BGA with hot air systems (ie, AirVac, SRT) is fairly complicated and requires fairly rigorous process control.

Please compare and contrast BGA rework using hot air and your laser based system.

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Erick Russell

#6265

Re: Why would I want to use photonic soldering for my rework applications? | 20 September, 2000

Process control for Photonic soldering is based on the actual temperature of the component being reworked. If the desired temperature of the component for your process is 200C then that is the process temperature programmed. This is achieved by a closed loop control of the surface of the component using a non-contact temperature sensor. For hot-air systems, a thermocouple controls the �temperature� of air in a nozzle. The resulting temperature on the component is based on air-flow rates, nozzle design, incoming air pressure, and top heater element response, and nozzle distance from the board surface. This is very complicated to control and increases variation in process. For �hot air systems� there is no way to control uniformity of package heating unless the process is slowed down. Photonic soldering achieves uniformity of heating by controlling the heat input at every point on the component.

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