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SMT electronics assembly manufacturing forum.


Toe down configuration

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#64594

Toe down configuration | 6 July, 2011

Has anyone come across any good visuals for the solderability requirements for component leads with toe-down configuration? IPC-A-610 does not have any visual aids for this category and our inspectors are having a difficult time assessing based solely on the wording - "...minimum heel fillet (F) extends at least to the mid-point of the outside lead bend." Thanks in advance for any input.

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#64637

Toe down configuration | 11 July, 2011

Take a picture of one that just barely meets specs. Take a photo of this, either under a scope or with one of those USB scopes. Then use the photo for whatever instructions you provide to the operators.

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#64732

Toe down configuration | 31 July, 2011

Try the NASA Workmanship Standards Inspectors Pictorial Reference document: http://workmanship.nasa.gov/lib/insp/2%20books/frameset.html

Look at Section 7.08 SURFACE MOUNT TECHNOLOGY (SMT) BUTT "I" LEADED PACKAGES

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