Chip Die Damage

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Hi, Recently we have found a chip on a card having very sma... - Dec 03, 2012 by MEO

what type of part is this a micro BGA by chance? there is a ... - Dec 05, 2012 by CPI

The package is flip chip BGA (FCBGA592) I found some info o... - Dec 06, 2012 by MEO

Try MIL-STD-883 Method 2017 Die inspection service provid... - Dec 07, 2012 by davef

Thats the one I was thinking of!! thanks Dave! ... - Dec 07, 2012 by CPI

MEO

#67718

Chip Die Damage | 3 December, 2012

Hi, Recently we have found a chip on a card having very small damage on the die corner. I would like to know if there are some industry standard criteria of acceptance available. If not, what would you recommend?

Attachments:

damaged corner.jpg

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CPI

#67749

Chip Die Damage | 5 December, 2012

what type of part is this a micro BGA by chance? there is a mill spec (man I cant remember it right now), I'll get back to you! it provides acceptance criteria for chip/crack/gouges.... if it doesn’t expose the lead frame (inner workings of the device), if its a crack and it doesn't lead toward the inners or the lead/bump/ball(it starts on top and leads toward the component edge), you can see the end of the crack or chip,,,its acceptable (per this mil spec)

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MEO

#67774

Chip Die Damage | 6 December, 2012

The package is flip chip BGA (FCBGA592) I found some info on leadless devices damages in IPC610 but it is not exactly what I am looking for.

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davef

#67781

Chip Die Damage | 7 December, 2012

Try MIL-STD-883 Method 2017

Die inspection service providers may be willing to help

Services, Die inspection * Amkor amkor.com * Syagrus Systems syagrussystems.com

SMTA has published a lot of papers that track to 'die' & 'inspection' but most often the paper relate to die attach and underfill, which is not where you're interested. But you might check there, something may pop-out to you.

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CPI

#67788

Chip Die Damage | 7 December, 2012

Thats the one I was thinking of!! thanks Dave!

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