BGA Reballing Micro Devices

I am trying to determine who out there is reballing devices below 0.4mm in pitch.

We have been reballing as small as a 4-balled 0.15mm 4 mil ball diameter area array devices using an adhesive-backed reballing preform.

1. For such small devices we have found that this is the only low volume, non-capital intensive way to go. Does anyone use another method fitting this criteria successfully? 2. How do you hold the parts when they are of this small size? What kind of fixturing are people using ? We use a simple stainless steel fixtures 3. What kind of deballing method are you using for these micro packages? We are using a non contact solder excavation system

Thanks!

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