I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector against the pallet flow direction. My preheat is 130 deg C & contact time of 7 sec. PCB finish is ENIG, SAc 305 alloy & Kester 979 flux, if I reduce the conveyor speed I had PCB blister on the secondary side. Pls advice hope to improve the barrel fill issues.Pin the hole ratio is following DFM requirement & I am using selective pallet wit pallet opening on THM location, the pallet is optimize with shadow effect. Thanks.
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