Hey....sneaky smartie here.... my finance manager, would love to have you on the MRB team....
Anyway, most technical paste specs, do highlight the possibility, should the paste become "dry" or "sticky", we MAY recondition the paste, by "place it from stencil into empty jar", and "add in 2-3 drops of so-so-brand Thinner", and "mix for 2-3 mins with spatula" and Volia!!! it *paste* is ready for use....
Only problem I sense with this, actual guidelines from the supplier, is who the hell is gonna confirm, that use of such paste, isn't gonna messup my PCBA solder fillets?
and should the nicky-picky customer, use a fine-tooth comb, to seperate my processes, into segment audit items, how do we assure the customer, that such paste has no potential reliability issue? *shhessshhhh.....where's that legal lawyer???*
Been there, done that, am still opinionated, to declare, until some industrial guideline, is published by recognized eggbrain(s), still rather propose, any yellowish liquid layer, floating above squishy/harden grey matter (no...that stuff ain't your brain....) its all unproven *unstable* techniques, of saving costs of expired paste.....
Of coz, I could be wrong, so for the skeptical, just go ahead and publish your data & proof, and then we can have industrial leadership evidence, to show that nicky-picky customer, who needs such proof, before reaching general consensus, to permit questionable solder paste, on a PCBA that the customer, paid good money, to have assemblied....
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