> Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of the > chip easily, so do you have ideas about the > issue? and how to avoid it? We use 0.7 mil Au > wire and the pad is plated with gold.
> Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of the > chip easily, so do you have ideas about the > issue? and how to avoid it? We use 0.7 mil Au > wire and the pad is plated with gold.
You might also consider bond cratering where the bonding force ruptures the underlying silicon, e.g. http://www.semlab.com/blog/?p=69 & http://www.semlab.com/blog/?p=191
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