Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
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Hello,
I was at a IMAPS conference last year 2016 and sev...
- Mar 14, 2017
by
PZappella
I don't have an answer but I am curious.
What data/testin...
- Mar 14, 2017
by
Sr. Tech
I've always been happy with ~25% or less combined voiding on...
- Mar 14, 2017
by
dontfeedphils
@ Sr.Tech,
Any voiding means that the part of the package...
- Mar 15, 2017
by
Robl
Rob,
That's what I suspected but I would be interested to...
- Mar 15, 2017
by
Sr. Tech
It's well documented in higher power semiconductors where th...
- Mar 15, 2017
by
Robl
From what I know, you should follow IPC standard for the cla...
- Mar 15, 2017
by
Evtimov
Hi Etimov,
Understood that to us assembling parts that IP...
- Mar 15, 2017
by
Robl
Hello,
A speaker at the conference is where I heard that ...
- Mar 15, 2017
by
PZappella
Hi Phil,
25% sounds real high to me, any failures availab...
- Mar 15, 2017
by
PZappella
Hello Rob,
I totally agree with you. Is this a real pr...
- Mar 15, 2017
by
PZappella
Hi PZ,
What, sort of like this one?
...
- Mar 15, 2017
by
Robl
Rob,
I believe that is for die attach voiding not solder in...
- Mar 15, 2017
by
Sr. Tech
Rob,
Absolutely agree. Customer precedes standard. As you m...
- Mar 15, 2017
by
Evtimov
Customer precedes standard, but customer must be educated an...
- Mar 15, 2017
by
Sr. Tech
It's the same thermal issue whether it's a die or package. ...
- Mar 16, 2017
by
Robl
Hi Rob,
Thanks for the LED paper. I like the void area ...
- Mar 16, 2017
by
PZappella
I think the main driver is MTBF data driven by the Car OEMS,...
- Mar 17, 2017
by
josh
In IPC it is said that the void % should be established betw...
- May 31, 2017
by
Buckcho
Hi, please go through IPC 7093, its only for design and asse...
- Apr 28, 2018
by
Shuhaib uv
In the past I have worked on 600 Amp FET Blocks. The rule wa...
- May 01, 2018
by
sarason