We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned portion of the leads and the component body. On the received components from the manufacturer, the solder has wicked all the way up the lead under the body. Now the wicked solder does not come off of the lead and touch the surrounding body, but I was under the assumption that solder shouldn't wick fully up the lead so that it is actually on the lead that is underneath the body. If I could show a picture it would be very clear but the part in question is UT54ALVC2525. You can see on its datasheet the lead goes all the way under the body of the component and this is where the solder has wicked all the way up to but does not leave the metalized area.
This message was posted the
Electronics Forum @ SMTA
reply »