DFN Solder Quality

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Hello. I got an email from a customer who thinks we have a c... - Jul 30, 2024 by SMTA-68146200 SMTA

In case of DFN and QFN package the most of the connection is... - Jul 30, 2024 by Szilard

Thanks for your reply. My customer is telling me that once ... - Aug 01, 2024 by SMTA-68146200 SMTA

Hello. Since a DFN is a BTC component, an end fillet height ... - Aug 07, 2024 by SMTA-64386252 SMTA

If the connection is poor you would need to consider was the... - Aug 08, 2024 by Carl_P

SMTA-68146200

#91233

DFN Solder Quality | 30 July, 2024

Hello. I got an email from a customer who thinks we have a cold solder problem. I doesn't look like it wicked but since there are pads underneath, shouldn't that have bonded?

This message was posted via the Electronics Forum @ SMTA SMTA

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Szilard

#91234

DFN Solder Quality | 30 July, 2024

In case of DFN and QFN package the most of the connection is made on the bottom side of the terminal. According to the IPC is not mandatory to have the tip (side flank) to be wetted. Since it is difficult to visually inspect the solder joint, Xray is the preferred method. You should check the datasheet because there are non side flank wettable terminals and side wettable terminals. The later is easier to inspect with an AOI and the solder joint reliability is icreased. Taken into account the amount of the information provided by you it is still possible that the solder joint is not acceptable.

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SMTA-68146200

#91251

DFN Solder Quality | 1 August, 2024

Thanks for your reply. My customer is telling me that once he touched it up and made a connection to the sides, he got a good signal. Is it possible that the connection underneath was poor? If so, what might be the cause of that?

This message was posted via the Electronics Forum @ SMTA SMTA

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SMTA-64386252

#91288

DFN Solder Quality | 7 August, 2024

Hello. Since a DFN is a BTC component, an end fillet height is not required on IPC 610 since most of these components did not have a wettable surface on the sides.

A cross section in a non-touched up sample could be performed to validate the solder joint quality, intermetallic junction and solder structure on the affected signals.

If there is an issue with solder joint, cross section can help to understand what is happening.

This message was posted via the Electronics Forum @ SMTA SMTA

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Carl_P

#91293

DFN Solder Quality | 8 August, 2024

If the connection is poor you would need to consider was the solder volume correct & is the oven profile correct?

Was the paste mixed correctly & within all operating windows such as exp date, time out etc etc

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