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parts moving after placement?

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#91277

parts moving after placement? | 6 August, 2024

I'm having a lot of trouble placing a long thin connector (DF40C-100DS from Hirose) all my other parts including 0.3mm pitch parts are placed very well, but this part is much longer than anything else and is often placed with rotation or position errors.

I'm using a custom nozzle as I thought it was moving after the nozzle picked it up, but now I'm thinking it could be moving after it's placed. The paste has basically no marks on it, and the parts can be easily moved with even the lightest tap on the board. How should I fix this? Increased placement force? Stickier paste? Placement is with a UIC GX11.

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#91279

parts moving after placement? | 6 August, 2024

Poly,

I don't know the UIC GX11 but on other machines I would first look at component height in the program. If it is not in the paste you may have the part height set too high which means you are dropping it onto the past not pushing it into the paste. Possibly your machine just looks at pressure to decide if it is down so yes in that case increase the pressure. Just make sure you don't end up slamming the connector into the board. That will give you a whole new set of issues.

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#91282

parts moving after placement? | 7 August, 2024

We are working with ASM SX machines. To solve similar issues, it is necessary to check the PCB thickness in addition to the component height. Reduce the placement speed. Check the possibility of correcting the placement profile for the component. If there are local fiducials for this component, use them.

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#91330

parts moving after placement? | 19 August, 2024

Perhaps moving this connector to the end of the placement sequence will help. Depending on the connector height, a nozzle traveling across the board could be hitting it. Another possibility to consider, a different part could have a wrong part height(smaller than the actual part) which causes the nozzle to push down too hard and flex the board which disturbs this connector. Placing this connector dead last in the sequence should help eliminate those possibilities.

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SMTA-69549243

#91339

parts moving after placement? | 22 August, 2024

I would also consider the smount of solder paste. If it can be increased, there might be better adhesion of the component between assembly and reflow.

This message was posted via the Electronics Forum @ SMTASMTA

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