PCB Storing Conditions

I'm wondering if everyone can give me opinions on what the industry standard is in a contract manufacturing environment for bare board PCB storage in terms of mitigating delamination and MSD related defects.

Our facility is currently using vacuum sealed bags, dessicant, and HIC cards. We bake any boards that we've had longer than 6 months for 4 hours at a temp based on boards layers, copper weight, etc.

Someone told us that without a dry room we would continue to have delamination issues. Is this standard in a contract manufacturing environment? I'd understand in an OEM, but a CM with a dry room is not something I've personally

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