hello all, Im working as a process eng'r for BGA package. We are using a water soluble flux for solder ball attachments...so there's still a need for a defluxer machine (using DI water) to clean the BGA strip after reflow.
I just want to ask regarding the so called NO CLEAN FLUX.Is there a need for defluxing it?(it will reduce the manufacturing cycle time if it not needed), How does it works? etc, etc...
Thanks for all the info that you'll give...
Omat Marasigan
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