| I need some opinions (And I know everybody has one). | I am mounting a board into a case, after mounting the board | I am loading it with stress in the middle causing it to bend around .030 inch. The board is 4" X 6" and is Bending in the 4" direction. The board is gold flash and is used for consumer electronics (Sub aquatic sonar, biologic locating device) What is the possibility of getting latent failures from joint stress? Are there any specs that address this issue? I think I need a drink | Mike | | Mike: I'll give you a half (two thirds) hearted support. Your boards are 0.75% out-of flat (100*0.03/4.00), if I haven't messed-up the math. Opinion #1: I think your boards should be accepted best two out-of three:
1 IPC-A-600 allows bow & twist of 1.5% 2 Rule of thumb (Opinion #2) #1: Goal 0.005" per inch; practicle 0.007" per inch. See I'm usin' opinions to support my opinions. Now that's delux opinionation. None the less, you don't make on this count, bud. 3 Rule of thumb (Opinion #3) #2: IPC-A-600 1.5% for PTH only and 0.75% for SMT
... but next time I'm out in my bass boat with my Poppel Pocket Fisherman, and a delicate piece of electronic gear, and I'm not reelin' those puppies in, I'ma gonna pop the cover off that dude and check for warped boards and a faint wiff of an adult beverage.
TTYL Dave F
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