Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
Using convection type reflow we observed following problem:...
- Nov 01, 2000
by
Please check with Fab house, what is the thickness of the i...
- Nov 02, 2000
by
Dason C
Thank you for your hint. According to the substrate supplie...
- Nov 03, 2000
by
We have seen this problem several times. It always goes bac...
- Nov 06, 2000
by
Thomas: Wheeee, a 40% failure rate. Now, that make your b...
- Nov 06, 2000
by
davef
Thank you for your kind contribution and efforts in helping...
- Nov 07, 2000
by
Cheers to you
Your gold plating is specified for the gold...
- Nov 07, 2000
by
davef
We have few failures similar to the discussion in this threa...
- Jan 17, 2001
by
>We find that the raw BGA's pad sheared surface has the SnPb...
- Jan 17, 2001
by
davef
We find that the raw BGA's pad sheared surface has the SnPb ...
- Jan 18, 2001
by
Arulvanan P
Intermetalic Layer (IL). A compound formed at the interface...
- Jan 19, 2001
by
davef
I just can not get over the size of these crystals. What is...
- Jan 21, 2001
by
davef
Dave,
To do further analysis we don't have the BGAs of the ...
- Jan 30, 2001
by
Arulvanan P
This BGA could have gone through the reflow cycle two times ...
- Jan 30, 2001
by
Arulvanan P
Thomas Ballhausen