I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not able to withstand all the heat of the solder pot being that it is a solid metal material? Any ideas or solutions would be appreciated. Rob Williams Rwill@westell.com