| Should I use thermals or direct connects on | vias from BGA pads to power planes. The via is | connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capable of preventing "thermal drain." Your description needs more clarification. Your specific parameters are (how long is 8 mil wide trace into how large a pad with what diameter via, with what distance to the reference plane)? Is there an electrical issue concerning your question?
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