| | What does the term "poor wetting" mean as a defect code ? "Poor" should mean unacceptable when surface (component or PCB solder termination areas) wetting does not provide acceptable solder joints. Unacceptable wetting of PCB solder termination areas (SMT pads, as an example) are determined after HASL, or other solder coating processes are effected, after solder sample testing, or after soldering operations. Unacceptable wetting of component soder termination areas is found during solder testing (wetting balance, as an example) or after soldering processes. Industry has not clearly defined the extent or amount of unacceptable wetting. For me, non or dewetting exceeding 5% on a given solder termination area is unacceptable. Industry clearly has defined unacceptable wetting concerning solder joint formation.
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