Voids and BGA

From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you have some informations, please give me it.

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| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | If you have some informations, please give me it.

I replied to your inquiry directly by email but did not see your question about voids in BGA balls. If they are present and are eutectic, they must not be excessive and doubt their existence. If they do exist, they should be removed during solder processing when eutectic. When high temperature solder balls, and not excessive, they should not be a problem, but will not go away with processing. Concerning voids in solder joints, contamination (as excessive oxidation) is of primary concern. Don't forget other contamination as grease, dirt, finger prints, oil, etc.. Handling and shelf life is very important. Best wishes Earl Moon

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