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Hi All. I am looking for a typical Pull Test Results for ... - Aug 15, 2001 by USingh

A properly formed solder connection is stronger than the und... - Aug 15, 2001 by davef

USingh

#17211

Pull Test | 15 August, 2001

Hi All.

I am looking for a typical Pull Test Results for the adherence of 0402 / 0603 components to the pads.

Thanks USingh

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davef

#17216

Pull Test | 15 August, 2001

A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requirement for Cu is: 6 lb (force)/in [106 kg (force) /m].

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