This is an interesting dilemma you have been faced with. If both machines are outfitted similarly and running under identical process settings then they should produce nearly the same results, in theory. I do not dispute the observations you are reporting, since this is what your data indicates. But you should not have to use two different stencil designs. Without actually being at your facility to witness your process, it is difficult to make any sound conclusions. I suspect the underlying causes for these differences are likely to run a bit deeper than looking at the standard program parameters. There may be some differences between the squeegees, tooling support, board clamping, or solder paste that you have not mentioned which could be causing different results to occur.
-Jeff
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