Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
We are to use a PBGA 272 and a PBGA 388. Between 500 and 750...
- Nov 12, 2001
by
emmanuel
One of the key elements you need to keep in mind......What "...
- Nov 12, 2001
by
CAL
Underfill is primarily used in flip chip, CSP attach applica...
- Nov 12, 2001
by
davef
Underfilling PBGA's will increase the PCB level solder joint...
- Nov 15, 2001
by
Hey Terry. You make points that would be interesting to man...
- Nov 15, 2001
by
davef
Yes, i confirm you that the BGA i'm refering to are Motorola...
- Nov 21, 2001
by
emmanuel
emmanuel