The joint IPC/JEDEC standard currently specifies a limit of one bake cycle, regardless of the temprature or duration. In the proposed revision this will be replaced by a maximum cumulative duration of 48 hours at 125C.
The reason identified for this limit is solder oxidation and/or intermetallic growth, which if excessive can result in solderability problems during assembly.
The standard also specifies that if the limit is to be exceeded the supplier should be consulted.
My opinion is that you should handle this the same way as you would any other component with solderability issues.
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