Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
For the COB process, what thickness for plating Au is suitab...
- Sep 24, 2002
by
andy
we used the ball bonding, just normal chip on board.
as I...
- Sep 24, 2002
by
andy
I spec COB using wire bond attach - 0.75um � 0.25 Gold over ...
- Sep 27, 2002
by
POC
Mar,
The previous post makes the best point. Your finish...
- Sep 27, 2002
by
davef
andy
andy