OK
I know it is funny to have two different PWB/PCB processes, one for pre production and one post production yet it is possible if controlled and implemented in a strategy. In debug if your company's experience has been for a repeated need to do ICT, and probably functional, in some cycle of development, then HASL or one of the lower contact resistance materials are a better match for your temporary debug needs. More - -
OSP is a bummer from an automated many points test strategy if you have to go through repeated tests after heat is applied to the OSP as well as go through cycles of testing refinement. Oxides after soldering just build too fast for most of the environments we live in and make the lives of many points test engineers, much more difficult. NOW give us a technique that uses two hands with a mouth and other body parts to hold probes then maybe we could do OK. Yet the cost is prohibitive on a circuit by circuit basis to create a manufactuing process. Bummer.
YiE, MA/NY DDave
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