8 MIL VIAS OPENING DURING THE ASSEMBLY PROCESS

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WE ARE EXPERENCING OPEN 8 MILL VIAS UNDER THE BGA'S, THEY AR... - Dec 13, 2002 by

I've seen this type of problem before. You need to get on yo... - Dec 13, 2002 by Ken McNeeley

STEPHEN WALTERS

#22703

8 MIL VIAS OPENING DURING THE ASSEMBLY PROCESS | 13 December, 2002

WE ARE EXPERENCING OPEN 8 MILL VIAS UNDER THE BGA'S, THEY ARE OPENING AFTER THE ASSEMBLY PROCESS, THEY ARE FROM MULTIPLE PCB VENDORS, THEY PASS AT THE PCB SUPPLIERS TESTING, AND WE HAVE FOUND THAT THEY HAVE HAD 2 MAJOR CAUSES 1. BUBBLE INTRAPMENT, 2. DEBRIS IN THE BARREL. WE EXPECT TO SEE SOME FALL OUT FROM THE PCB SUPPLIER BUT THIS PROBLEM IS HIGHER THAN THE 1% WE WOULD EXPECT TO SEE. IS ANY ONE ELSE SEEING THIS KIND OF PROBLEM?

THANKS STEVE

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Ken McNeeley

#22705

8 MIL VIAS OPENING DURING THE ASSEMBLY PROCESS | 13 December, 2002

I've seen this type of problem before. You need to get on your bare board vendors. It's a process problem for them. When you add the heat in reflow or wave solder the vias open. I'd get the vendor involved and reject the bare boards. There is still a chance of failures happening later down the line. (After you ship to your customer). If your vendor can't do 8 mil vias reliably, get a new vendor.

Thanks, Ken

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