Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
Through hole question - what methods can be used to obtain u...
- Aug 05, 2003
by
MGL
Hi matt-
You describe the board but did not indicate the co...
- Aug 05, 2003
by
CAL
Hi,
Have you tried increasing the vibration at the main ...
- Aug 05, 2003
by
Kris
Another variable is whether the ground pads have proper ther...
- Aug 05, 2003
by
CSIMFGENG
Try to mechanically force the solder up the holes if it is e...
- Aug 05, 2003
by
Check the areas that are getting solder on the top side. If ...
- Aug 05, 2003
by
MikeF
more heat heat, more time in wave
...
- Aug 05, 2003
by
Hi,
One thing you might want to do has to deal with the v...
- Aug 05, 2003
by
Cardinal Circuit
Thanks to all who have responded. The boards we are waving a...
- Aug 06, 2003
by
MGL
Is it possible the solder hole(s) is too large and the solde...
- Aug 07, 2003
by
We do allot of multi layer boards with heavy ground planes o...
- Aug 07, 2003
by
Problem areas are always ground connections. 20 pin dips hav...
- Aug 08, 2003
by
MGL
what, no top side preheat?
...
- Aug 08, 2003
by
Top and bottom preheat - topside temp 250 plus at times atte...
- Aug 08, 2003
by
MGL
Assuming you are working to IPC standards, are you working t...
- Aug 11, 2003
by