Hi Ivan,
J-STD-001C chapter 3.6.2 says temperature should be maintained between 18�C and 30�C and humidity should not exceed 70% and below 30% verification of electrostatic discharge control is advised. This is a wide range and I wouldn�t allow a swing from one end to the other cause that would definetly affect solderability and overall quality. 25�C is a temperature you wouldn�t adjust in your home for a comfort feeling but due to the machinery used it�s sometimes hard to obtain a lower temperature in the assembly site. If you adjust your processes to a certain temperature and humidity it�s more important to keep the changes low than to adjust for something that�s difficult to obtain.
M2C
Wolfgang
reply »