Hi CT,
The bake requirements for Moisture Sensitive Components are defined in table 4-1 of the joint IPC/JEDEC J-STD-033A (link for free download at http://www.cogiscan.com, click on MSD Knowledge Base/Introduction).
Normally you pick the highest possible temperature to minimize the duration. In this case, depending on the components already assembled on the board this could be 90C or 125C. The total time will depend on the MS level and body thickness of the component you want to remove. This can range from 3 hours to 10 days.
Let me know if you have any other question on this subject.
Regards,
Francois Monette Cogiscan Inc. Tel : 450-534-2644 fmonette@cogiscan.com
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