Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards
Not intending to insult you, but terms used to describe solder connections are often specific. �Cold solder� is very uncommon in SMT solder connections. It is more closely related to wave soldering and hand soldering. Generally cold solder connections are caused by: * Solder temperature: too high, too low * Conveyor speed: too high, too low * Contamination of solderable surfaces.
We would like to help you understand your problem better. So, it would help if you told us more about your situation. For instance: * Appearance of your defective solder connection. * Process [ie, paste, reflow profile, conveyor, etc.]. * Component [ie, type, termination finish, etc.] and board [ie, solderability protection, solder mask type, thickness, etc.] * Distribution [ie, new / old problem, one / many products, location on board, etc.] of your defective solder connection.
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