One of the difficulties with BGA rework is excessive heating of the internal package (die) temperature. We have several "SRT" hot air rework systems which work well, but with Pb-Free components the challenge becomes even greater. The question I have - is there a better technology than hot air to handle this rework?
Specifically, I am inquiring of Selective Soldering (BGA rework) utilizing lasers. There are several companies, one of them being VI Technologies, selling equipment that allegedly develops no "hot spots" in a component. How does the laser access solder balls under the package? In theory, having a tool which applies heat at "point of use" and keeps the internal die as well as close adjacent components at relatively low temperatures would be utopia.
Is there anyone out there that has real life experience with BGA rework using laser reflow equipment?
Thanks.
reply »