Hi,
I have the below PWB Specifications:
Dimension: 7.25 inches L x 6.45 inches W Thickness: 0.102" (2.5mm) No. of Layers: 12 Material: FR4, Tg >=130�C as per IPC-4104/21
What will happen if I expose the PWB Assembly with components to a temperature of between 135'C to 152'C, which is above Tg, for 1 hour? Will there be delamination or possible damage to my PWB? What about with the rests of the components (0603's, 0805's - ceramic caps etc.)? How about my PBGA with FR4 which will suffer on the same stressful temperature exposure?
The reason for this exercise is a proposal to solder some connectors with more than 200 pins for modification and requires a hot plate with 185'C temp under the PWB during the modification process. Estimated tact time for the process is 60 to 90 minutes.
Thanks in advanced.
Dreamy Thanks and regards,
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